An Unbiased View of Noohapou
An Unbiased View of Noohapou
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The POU3500 technique presents dynamic temperature Charge of the process chamber cathode / electrode / anode and can be synchronized with any etch approach.
30% of its peak electrical power intake, offering our buyers sizeable reduction in running fees and increased dependability.
Together with the POU3500, you are able to realize unprecedented brings about etch performance, chamber uptime, decreased cost of ownership and fab Area utilization – all even though strengthening your method reliability.
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LAUDA-Noah will, for just a buyer's retrofit analysis, keep track of and adjust its fluid temperature Management profiles to match an current TCUs' in order to ensure Noohapou a clean procedure integration by means of DAQ.
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All static TCUs call for extra cooling & heating capacities because of their incredibly huge method fluid reservoirs. the procedure fuid reservoir on LAUDA-Noah's dynamic temperature Regulate system is fewer than one gallon.
Along with the POU3300, it is possible to reach unparalleled ends in etch effectiveness, chamber uptime, decreased expense of possession and fab Place utilization – all even though increasing your method dependability.
The data pertains to your 300mm chamber temperature profile during a high facet ratio Etch approach, operating at extremely significant RF energy ailments (~three.8kW). The powerful areas of this knowledge established are:
Dynamic Temperature Management, as executed in programs similar to the LAUDA-Noah POU, is definitely an approach that senses the temperature of the procedure fluid getting back from the process chamber’s wafer chuck (ESC) and dynamically adjusts the temperature with the equipped method fluid based on this true-time feed-back.
the info established here is from a 200mm volume production wafer fab and Evidently illustrates the advantage of the LAUDA-Noah POU procedure.
greater than ever, shrinking machine geometries, demanding new procedures in addition to a very competitive natural environment have to have temperature Manage programs that combine rapidly and correct temperature Regulate with the emphasis on minimized functioning prices and improved reliability.
Confirmed; TEs' characterize just one A part of a chiller's style and design. The switching & Regulate solutions used by a chiller will influence the TEs' reliability.
(thus, putting in a static device close to chamber will not empower it to offer dynamic temperature Regulate)
We have to have a lot less cooling/heating capability for the same application for a static TCU due to our little reservoir volume.
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